Interfacial Reaction of Ag Bump/Cu Land Interface for B2it Flash Memory Card Substrate
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چکیده
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ژورنال
عنوان ژورنال: Journal of the Microelectronics and Packaging Society
سال: 2012
ISSN: 1226-9360
DOI: 10.6117/kmeps.2012.19.1.067